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P/N	Brand	D/C	Package	Qty	Remark
KLM4G1FETE-B041	SAMSUNG	22+	BGA153	6000	Serial e-MMC MLC v5.1 4GB
FAN7382MX	ON	22+	8-SOIC	4000	Half-Bridge IGBT, N-Channel MOSFET 350mA, 650mA 8-SOIC (0.154", 3.90mm Width) Exposed Pad 10V ~ 20V 0.8V, 2.5V 600V
KLM8G1GETF-B041	SAMSUNG	22+	BGA153	2240	Serial e-MMC 1.8\|3.3V MLC v5.1 8GB
FDS6679AZ	ON	22+	SOIC-8	3000	P-Channel 30V 13000mA(TA) 4.5V,10V 0.0093Ω@13000mA,10V 25V,-25V 2.5W(TA) -55°C~150°C(TJ) SOIC-8(3.90mm )
KLMAG1JETD-B041	SAMSUNG	22+	BGA153	3360	Serial e-MMC MLC v5.1 16GB
CSD17576Q5B	TI	22+	PowerTDFN-8	2000	PowerTDFN-8 -55°C~150°C(TJ) N-Channel 100000mA(TA) 0.002Ω@25000mA,10V 3.1W(TA),125W(TC) 20V,-20V 30V
KLMBG2JETD-B041	SAMSUNG	22+	BGA153	3360	eMMC architecture for embedded memory MLC v5.1 32GB
FAN6300AMY	ON	22+	8-SOIC	5000	8-SOIC (0.154", 3.90mm Width) Flyback -40°C ~ 105°C (TA) 8V ~ 25V
KLMCG4JETD-B041	SAMSUNG	22+	BGA153	2240	MLC v5.1 64GB
CAT809TTBI-GT3	ON	22+	SOT-23-3	6000	TO-236-3, SC-59, SOT-23-3 Push-Pull, Totem Pole Simple Reset/Power-On Reset 1 3.08V

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